VideoLibrary

How to Install Push Pin Heat Sinks

ATS has expanded its line of push pin heat sinks, now providing straight fin, cross cut, and maxiFLOW heat sink configurations for a wide range of component sizes. The push pins are available in plastic, brass, or with a stainless steel hardware kit allowing over 108,000 packaging options.This video demonstrates how to install push pin heat sinks to a PCB board.

7/18/2014 1:50:55 PM

How to Install Push Pin Heat Sinks

ImmagineCodice produttoreDescrizioneQuantità disponibilePrezzoVedi i dettagli
HEAT SINK 56MM X 56MM X 52MMATS-57000-C1-R0HEAT SINK 56MM X 56MM X 52MM81 - Immediatamente$60.66Vedi i dettagli
HEAT SINK 94MM X 94MM X 27MMATS-57003-C1-R0HEAT SINK 94MM X 94MM X 27MM97 - Immediatamente$42.31Vedi i dettagli
HEATSINK 25X25X10MM L-TAB CPATS-CPX025025010-137-C2-R0HEATSINK 25X25X10MM L-TAB CP3770 - Immediatamente$2.66Vedi i dettagli
HEATSINK 25X25X10MM R-TAB CPATS-CPX025025010-165-C2-R0HEATSINK 25X25X10MM R-TAB CP441 - Immediatamente$2.66Vedi i dettagli
HEATSINK 25X25X15MM L-TAB CPATS-CPX025025015-138-C2-R0HEATSINK 25X25X15MM L-TAB CP1341 - Immediatamente$2.75Vedi i dettagli
HEATSINK 25X25X15MM R-TAB CPATS-CPX025025015-166-C2-R0HEATSINK 25X25X15MM R-TAB CP504 - Immediatamente$2.75Vedi i dettagli
HEATSINK 25X25X20MM L-TAB CPATS-CPX025025020-139-C2-R0HEATSINK 25X25X20MM L-TAB CP802 - Immediatamente$2.83Vedi i dettagli
HEATSINK 25X25X20MM R-TAB CPATS-CPX025025020-167-C2-R0HEATSINK 25X25X20MM R-TAB CP140 - Immediatamente$2.83Vedi i dettagli
HEATSINK 25X25X25MM L-TAB CPATS-CPX025025025-140-C2-R0HEATSINK 25X25X25MM L-TAB CP0 - Immediatamente$2.90Vedi i dettagli
HEATSINK 25X25X25MM R-TAB CPATS-CPX025025025-168-C2-R0HEATSINK 25X25X25MM R-TAB CP25 - Immediatamente$2.90Vedi i dettagli
HEATSINK 30X30X10MM L-TAB CPATS-CPX030030010-141-C2-R0HEATSINK 30X30X10MM L-TAB CP0 - Immediatamente$3.21Vedi i dettagli
HEATSINK 30X30X10MM R-TAB CPATS-CPX030030010-169-C2-R0HEATSINK 30X30X10MM R-TAB CP705 - Immediatamente$3.21Vedi i dettagli
HEATSINK 30X30X15MM L-TAB CPATS-CPX030030015-142-C2-R0HEATSINK 30X30X15MM L-TAB CP8 - Immediatamente$3.31Vedi i dettagli
HEATSINK 30X30X15MM R-TAB CPATS-CPX030030015-170-C2-R0HEATSINK 30X30X15MM R-TAB CP48 - Immediatamente$3.31Vedi i dettagli
HEATSINK 30X30X20MM L-TAB CPATS-CPX030030020-143-C2-R0HEATSINK 30X30X20MM L-TAB CP29 - Immediatamente$3.38Vedi i dettagli
HEATSINK 30X30X20MM R-TAB CPATS-CPX030030020-171-C2-R0HEATSINK 30X30X20MM R-TAB CP100 - Immediatamente$3.38Vedi i dettagli
HEATSINK 30X30X25MM L-TAB CPATS-CPX030030025-144-C2-R0HEATSINK 30X30X25MM L-TAB CP0 - Immediatamente$3.52Vedi i dettagli
HEATSINK 30X30X25MM R-TAB CPATS-CPX030030025-172-C2-R0HEATSINK 30X30X25MM R-TAB CP6 - Immediatamente$3.52Vedi i dettagli
HEATSINK 30X30X30MM L-TAB CPATS-CPX030030030-145-C2-R0HEATSINK 30X30X30MM L-TAB CP45 - Immediatamente$3.62Vedi i dettagli
HEATSINK 30X30X30MM R-TAB CPATS-CPX030030030-173-C2-R0HEATSINK 30X30X30MM R-TAB CP264 - Immediatamente$3.62Vedi i dettagli

Related Videos

MEMS Oscillator ruggedness vs quartz part 2
MEMS Oscillator ruggedness vs quartz part 2

Data di pubblicazione: 2018-03-13

MEMS Oscillator ruggedness vs quartz part 1
MEMS Oscillator ruggedness vs quartz part 1

Data di pubblicazione: 2018-03-13

ATS Explains - Thermal Interface Material
ATS Explains - Thermal Interface Material

Data di pubblicazione: 2018-01-26

Related Product Highlight

Soluzioni di attacco per dissipatori di calore Gli attacchi per dissipatore di calore di Advanced Thermal Solutions offrono agli ingegneri più opzioni per il fissaggio meccanico di quasi tutti i dissipatori di calore alle PCB.
108.000 dissipatori di calore pushPIN™ I dissipatori pushPIN sono disponibili in ottone e in plastica e sono confezionati con diverse molle di compressione per garantire la precisa forza necessaria per il fissaggio sicuro.
maxiFLOW™ pushPIN™ Heat Sink ATS' maxiFLOW heat sinks include an integral pushPIN mounting system for fast, safe attachment of the heat sinks onto BGAs and other hot components.

Related Articles and Blogs

Feasibility Study of an LED-Based Lighting System Using Analytical Modeling A study of the heat loads for an outdoor LED-based lighting system using analytical modeling to determine the feasibility of the design with solar heat load.
Device Thermal Coupling on a PCB A look at how components on a printed circuit board thermally couple and the design considerations that help minimize heat dissipation problems.
Air Flow Measurement in Electronic Systems An analysis of circuit board air flow measurement techniques and the considerations required to obtain an accurate reading in this complex environment.

Related Product Training Modules

Introduction to Heat Sinks This module will review the use of heat sinks, including how a heat sink works, the factors that impact heat sink thermal performance, common heat sink materials, and thermal interface materials.
pushPIN Heat Sink ATS’ pushPIN compression springs add the necessary force to hold the assembly together for secure attachment.
maxiFLOW™ Heat Sinks maxiFLOW heat sinks feature a low profile spread fin array that maximizes surface area. Available in a wide variety of sizes and shapes.