Solder preforms, wire, and ribbon are manufactured and packaged to minimize oxidation. Since no container offers complete isolation from oxygen in ambient air, solder will slowly oxidize, which may result in a reduction in wetting.

The alloys in this book are the result of decades of listening to our customers and finding solutions that enable cutting-edge technologies

Metal Thermal Interface Materials (TIMs) aid in the transfer of heat between surfaces and minimize the thermal resistance at each device connection.

For high-power devices, the performance of interconnect materials within the packaging is critical to achieve efficiency and longevity.

The automotive industry, emerging electric vehicles, and wafer-level packages with smaller pitch sizes demand higher reliability of solder joints, namely, the elongated lifetime and/or the survival of more aggressive service conditions, than the mainstream SAC305.

The theoretical volume of solder paste can be calculated for each board using the Greely Formula and a simple volume calculation.

Durafuse® LT serves as a high-reliability solution to several different application challenges employing a vast array of reflow processes to achieve different results.

Indium metal is extracted primarily from indium-bearing zinc or tin ores and purified to various grades utilizing state-of-the-art statistical process-controlled refining technologies.

Indium flux and solder compatibility application note.

Reducing the energy consumed by the reflow oven has a direct impact on reduced CO2 emissions. In addition to quantifying the energy consumed, there is a growing emphasis on the Life Cycle Assessment (LCA) of a product.

A manufacturer can choose either a rosin-containing or a non-rosin-containing flux based on the solvent used, the ratio of flux to solvent, and the current cleaning process, to name a few.

One of the biggest challenges facing the electronics industry today is voiding in the solder joints that connect bottom terminated components to PCBs.

Indium Corporation manufactures bar solder to surpass the strict quality demands of the surface mount industry, providing more consistent, reliable performance.

Il filo saldante monoconduttore di Indium Corporation è fabbricato nel rispetto degli standard di qualità elevati di ASTM B-32, J-STD-006 e JIS-Z-3282.

CW-807 è compatibile con le paste saldanti senza pulizia di Indium Corporation, i flussanti a onda e le comuni leghe per saldatura dolce.

I chip di saldatura in barre di Indium sono piccoli pezzi di barre in lega saldante di grado elettronico, utilizzati per riempire crogioli più piccoli o per accelerare la fusione della lega saldante in un nuovo crogiolo di saldatura.

La pasta saldante idrosolubile Indium6.6HF di Indium consente di eseguire processi di assemblaggio in SnPb e senza piombo con un'eccezionale finestra di lavorazione a rifusione.

Il filo animato senza pulizia, ad alte prestazioni e altamente attivato CW-219 di Indium è ideale per la saldatura robotizzata e a mano di superfici molto ossidate.

I flussanti in penna tecnologicamente avanzati di Indium contengono 10 ml di flussante ciascuno e sono dotati di un controllo delle perdite e di capacità di erogazione eccezionali.

Il filo animato CW-818 di Indium presenta proprietà di resistenza al calore e bassi schizzi, garantendo un assemblaggio dall'aspetto eccellente.