VideoLibrary

Wakefield Thermal Minute: 900 Series Chipset Heat Sink Attachment

Wakefield-Vette’s 900 Series Heat Sinks for BGA Chipsets can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and many more.

These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, Cloud Computing, and many more Industries.

4/12/2016 6:48:16 PM

Wakefield Vette Minute 900 Series Chipset Heat Sink Attachment

ImmagineCodice produttoreDescrizioneQuantità disponibilePrezzoVedi i dettagli
HEATSINK 21X21X12MM PIN902-21-2-12-2-B-0HEATSINK 21X21X12MM PIN3236 - Immediatamente$6.17Vedi i dettagli
HEATSINK 21X21X23MM PIN902-21-2-23-2-B-0HEATSINK 21X21X23MM PIN782 - Immediatamente$6.17Vedi i dettagli
HEATSINK 27X27X23MM PIN904-27-2-23-2-B-0HEATSINK 27X27X23MM PIN209 - Immediatamente$6.76Vedi i dettagli
HEATSINK 21X21X12MM ELLIPTICAL902-21-1-12-2-B-0HEATSINK 21X21X12MM ELLIPTICAL228 - Immediatamente$6.17Vedi i dettagli
HEATSINK 21X21X23MM ELLIPTICAL902-21-1-23-2-B-0HEATSINK 21X21X23MM ELLIPTICAL0 - Immediatamente$4.58Vedi i dettagli
HEATSINK 27X27X23MM ELLIPTICAL904-27-1-23-2-B-0HEATSINK 27X27X23MM ELLIPTICAL72 - Immediatamente$6.46Vedi i dettagli
HEATSINK 27X27X12MM PIN904-27-2-12-2-B-0HEATSINK 27X27X12MM PIN0 - Immediatamente$6.76Vedi i dettagli
HEATSINK 27X27X12MM ELLIPTICAL904-27-1-12-2-B-0HEATSINK 27X27X12MM ELLIPTICAL167 - Immediatamente$6.76Vedi i dettagli
HEATSINK 19X19X12MM PIN901-19-2-12-2-B-0HEATSINK 19X19X12MM PIN2574 - Immediatamente$5.90Vedi i dettagli
HEATSINK 19X19X23MM PIN901-19-2-23-2-B-0HEATSINK 19X19X23MM PIN0 - Immediatamente$5.90Vedi i dettagli
HEATSINK 19X19X12MM ELLIPTICAL901-19-1-12-2-B-0HEATSINK 19X19X12MM ELLIPTICAL284 - Immediatamente$5.90Vedi i dettagli
HEATSINK 19X19X23MM ELLIPTICAL901-19-1-23-2-B-0HEATSINK 19X19X23MM ELLIPTICAL199 - Immediatamente$5.90Vedi i dettagli
HEATSINK 31X31X12MM PIN906-31-2-12-2-B-0HEATSINK 31X31X12MM PIN200 - Immediatamente$7.42Vedi i dettagli
HEATSINK 35X35X12MM PIN908-35-2-12-2-B-0HEATSINK 35X35X12MM PIN160 - Immediatamente$8.14Vedi i dettagli
HEATSINK 31X31X12MM ELLIPTICAL906-31-1-12-2-B-0HEATSINK 31X31X12MM ELLIPTICAL128 - Immediatamente$7.42Vedi i dettagli
HEATSINK 35X35X12MM ELLIPTICAL908-35-1-12-2-B-0HEATSINK 35X35X12MM ELLIPTICAL180 - Immediatamente$8.14Vedi i dettagli
HEATSINK 31X31X23MM PIN906-31-2-23-2-B-0HEATSINK 31X31X23MM PIN0 - Immediatamente$7.42Vedi i dettagli
HEATSINK 35X35X23MM PIN908-35-2-23-2-B-0HEATSINK 35X35X23MM PIN5 - Immediatamente$8.14Vedi i dettagli
HEATSINK 31X31X23MM ELLIPTICAL906-31-1-23-2-B-0HEATSINK 31X31X23MM ELLIPTICAL224 - Immediatamente$7.42Vedi i dettagli
HEATSINK 35X35X23MM ELLIPTICAL908-35-1-23-2-B-0HEATSINK 35X35X23MM ELLIPTICAL5 - Immediatamente$8.14Vedi i dettagli

Related Product Highlight

Dissipatori di calore clip-chip serie 901-910 I dissipatori di calore clip-chip serie 901-910 di Wakefield Thermal sono facili da usare e supportano il raffreddamento termico dei chipset di Intel, Broadcom, TI e molti altri produttori.

Related Articles and Blogs

U.S. Energy Dept. Report Compares Energy and Environmental Impact of Lighting LED lighting suppliers are quick to claim that their products are more environmentally friendly than alternative technologies.

Related Product Training Modules

Chip Clip Heat Sinks This presentation will provide an overview of the 901-910 Series of Chip Clip Heat Sinks from Wakefield Thermal.